Bridged crack model of interfacial toughness

Interfacial fracture toughness of Pb-free solders

Increasing environmental concerns and pending government regulations have pressured microelectronic manufacturers to find suitable alternatives to Pb-bearing solders traditionally used in electronics packaging. Over recent years, Sn-rich solders have received significant attention as suitable replacements for Pbbearing solders. Understanding the behavior of intermetallics in Sn-rich solders is ...

Penny{shaped Crack Bridged by Fibres

An axi{symmetric problem for a penny{shaped crack bridged by bres is considered. The study is reduced to the analysis of a hy-persingular integral equation with respect to the relative crack{face separation over a circular domain occupied by crack. The special case of a large crack subjected to Mode{I loading is examined. A matched asymptotic expansions technique is used in order to estimate th...

Disordering of a Dynamic Planar Crack Front in a Model Elastic Medium of Randomly Variable Toughness

RICE et ml. (1994, J. Mech. Ph_vs. Solids 42, 813-843) analyse the propagation of a planar crack with a nominally straight front in a model elastic solid with a single displacement component. Using the form of their results for a strictly linearized perturbation from a straight crack front which moves at uniform speed, we give the corresponding first-order expression for the deviation of a crac...

Fracture toughness and fatigue crack growth characteristics of nanotwinned copper

Recent studies have shown that nanotwinned copper (NT Cu) exhibits a combination of high strength and moderate ductility. However, most engineering and structural applications would also require materials to have superior fracture toughness and prolonged subcritical fatigue crack growth life. The current study investigates the effect of twin density on the crack initiation toughness and stable ...

Buoyancy-driven crack propagation: the limit of large fracture toughness